| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a polishing pad, which method can reduce the dispersion of its thickness without increasing the number of manufacturing processes, and further to provide a polishing pad in which the dispersion of its thickness has been reduced and its polishing performance has been improved. <P>SOLUTION: A resin block 1 in the state before slicing is fixed on a base 2 having high stiffness (bending strength). Then, the surface portion of the resin block 1 to be sliced afterward is heated by means of a heating means 3. In such a state, a slicing blade 4 and the resin block are positioned in the direction of the height. Then, the slicing operation is carried out by relatively moving the slicing blade 4 and the resin block 1. By this method, the polishing pad acquires such characteristics that the dispersion of the thickness is within the range of ±15 μm over the whole polishing pad, and fine holes are uniformly distributed on its surface portion, and the ratio of the maximum diameter to the minimum diameter of the fine holes is within the range from 1.0 to 1.2. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
