| 摘要 |
PROBLEM TO BE SOLVED: To realize a semiconductor device which is low-cost to manufacture and is high-frequency and high-power by ensuring its high moisture resistance by solving the problem of deterioration in moisture resistance of the semiconductor device which occurs during conventional bare chip packaging by a simple structure. SOLUTION: The semiconductor device is provided with a protective metal film 41 which covers gate wiring 10 connecting several filamentary gates 1 through an insulating film 21. COPYRIGHT: (C)2006,JPO&NCIPI
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