| 摘要 |
PROBLEM TO BE SOLVED: To conduct a sealing with a high reliability in an electronic-element package. SOLUTION: In the electronic-element package 1, an electronic element 21 is stored by bonding a first substrate 22 with a mounted electronic element 21 and a second substrate 23. In the electronic-element package 1, the first substrate 22 and the second substrate 23 are joined by fitting a gold metal wall 221 surrounding the electronic element 21 to the first substrate 22. The width and height of the metal wall 221 are formed in 1μm or more, and the first substrate 22 and the second substrate 23 are metal-joined while plastically deforming the metal wall 221 in the height direction in this case. Accordingly, the bonding can be conducted while absorbing the irregularities and warps of the substrates by the metal wall 221, and the sealing in the electronic-element package 1 can be conducted with the high reliability. COPYRIGHT: (C)2006,JPO&NCIPI
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