| 摘要 |
PROBLEM TO BE SOLVED: To provide a simultaneous measurement method for a semiconductor integrated circuit which is easy to manufacture and can conduct tests on a plurality of chips in a short time. SOLUTION: In order to simultaneously measure a plurality of semiconductor chips formed in a matrix in x and y axis directions on a wafer, the simultaneous measurement method for a semiconductor integrated circuit simultaneously measures the semiconductor chips using a probe card 10 provided with probe pins (P1 to P4) of which the tips are brought into contact with a plurality of windows arranged in the positions aligned with the arrangement positions of a plurality of chips adjacent to each other in x and y axis directions and a bonding pad of the semiconductor chip corresponding to each window position, outputting a signal corresponding to the bonding pad. The arrangement direction of the probe pins is inclined by a predetermined angle with respect x and y axis directions so that the degree of overlapping of the probe pins in the probe card 10 becomes small. COPYRIGHT: (C)2006,JPO&NCIPI
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