发明名称 LOW MELTING POINT GLASS ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide a low melting point glass adhesive which is free from harmful substance such as lead or cadmium and has sufficiently low melting point and high weatherability. SOLUTION: The low melting point glass adhesive free from harmful substance and having sufficiently low melting point and high weatherability can be obtained by incorporating, by mol, 0.1-11% Ag<SB>2</SB>O, 0.1-20% R<SB>2</SB>O (wherein, R is one or two kinds selected from Li and Na), 60-80% TeO<SB>2</SB>, and 0-22% R'O (wherein, R' is one or more kinds selected from Zn, Ca, Mg, Sr and Ba). COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006143490(A) 申请公布日期 2006.06.08
申请号 JP20040332336 申请日期 2004.11.16
申请人 TOYO GLASS CO LTD 发明人 NOJIMA TAKANOBU
分类号 C03C8/24;C03C8/04 主分类号 C03C8/24
代理机构 代理人
主权项
地址