SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

A semiconductor device (1) is formed by die bonding a plurality of semiconductor chips (54) consisting of diode element chips (2) and resistor element chips (3) onto a plurality of tubs (52), electrically connecting the semiconductor chips (54) to the tubs (52) by a bonding wire (55), and then resin-sealing them. The diode element chips (2) and the resistor element chips (3) are manufactured by using a semiconductor substrate. The plurality of tubs (52) have the same shape and arranged in array, while being spaced equally, in the first direction and the second direction perpendicularly intersecting the first direction. Rear surface electrode of the semiconductor chip (54) is welded to the tub (52), and the bonding wires (55) in a plurality of directions connect the surface electrode of the semiconductor chip (54) with the tub (52) not having the chip and connecting between the tubs (52) not having the chip.