| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the attachment of particles to a reflection type reticle which is an original plate and to a wafer which is a substrate during transportation from the atmospheric environment to an exposure apparatus in a high vacuum state, in a semiconductor exposure apparatus which exposes a semiconductor substrate under the vacuum environment. <P>SOLUTION: The exposure apparatus includes a heating means which can heat the original plate or the substrate to a prescribed temperature in advance before carrying it to a load lock chamber, and a cooling means which can cool the original plate or the substrate to a prescribed temperature range after it is carried out of the load lock chamber. By heating the original plate or the substrate to the prescribed temperature in advance before carrying it to the load lock chamber, thermal migration force is generated in the particles which occur in the middle of transportation of the original plate or the substrate, resulting in suppression of attachment of the particles to the original plate or the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
