| 发明名称 |
POLISHING PAD AND POLISHING METHOD USING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad having very high flatness and capable of preventing the surface of a wafer from being damaged in surface planarization machining for a semiconductor device wafer. <P>SOLUTION: The polishing pad has a polishing molding as a constituent element. The tensile storage elastic modulus E'<SB>30</SB>at 30°C of the polishing molding is ≥3×10<SP>9</SP>dyn/cm<SP>2</SP>. A ratio (E'<SB>30</SB>/E'<SB>60</SB>) of the E'<SB>30</SB>at 30°C to E'<SB>60</SB>at 60°C of the polishing molding is 2-7. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
| 申请公布号 |
JP2006142438(A) |
申请公布日期 |
2006.06.08 |
| 申请号 |
JP20040336972 |
申请日期 |
2004.11.22 |
| 申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
NAKAGAWA HIROSHIGE;FURUKAWA TAKESHI |
| 分类号 |
B24B37/20;C08J5/14;C08L101/00;H01L21/304 |
主分类号 |
B24B37/20 |
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