| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a double sided wiring board which can correspond to high density/minute wiring, and to provide the double sided wiring board. SOLUTION: In a board material in which a first insulating layer 12 is formed on one face of a first conductor layer 11 formed of stainless and which is conveyed long, a through-hole 13 is formed passing through only the first insulating layer 12 or the first insulating layer 12 and the first conductor layer 11 from a prescribed part of the first insulating layer 12. A conductive thin film layer 14 is formed on a surface of the first insulating layer 12 and a wall face of the through hole 13. A second insulating layer 15 is formed in a prescribed part on the conductive thin film layer 14. First conductor wiring 16 is formed in a part where the second insulating layer 15 on the conductive thin film layer 14 is not formed by plating. First conductor wiring 16 is covered with a chemical-proof coat 17. The prescribed part of the other face of the fist conductor layer 11 is chemically dissolved by chemical. Thus, second conductor wiring 18 is formed, and the second insulating layer 15 and the coat 17 are removed. COPYRIGHT: (C)2006,JPO&NCIPI
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