发明名称 WIRING SUBSTRATE, METHOD OF ARRANGEMENT OF WIRING PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a wiring substrate having a given value of characteristic impedance of a signal wiring. SOLUTION: The first individual ground wirngs 21<SB>1</SB>-21<SB>6</SB>of a reticulated ground wiring pattern 20 are slanted with respect to the X-axis within the range of 1°≤θ<SB>1</SB>≤14°and two sides L<SB>1</SB>, L<SB>2</SB>of a parallelogram are specified so as to be L<SB>1</SB>≠L<SB>2</SB>. According to this method, the individual signal wiring 31 will not become parallel to the first and second individual ground wirings 21<SB>1</SB>-21<SB>6</SB>and will not pass on the intersecting points of the first individual ground wirings 21<SB>1</SB>-21<SB>6</SB>and second individual ground wirings 22<SB>1</SB>-22<SB>6</SB>, whereby the characteristic impedance of the individual signal wiring 31 becomes a given value. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006147837(A) 申请公布日期 2006.06.08
申请号 JP20040335748 申请日期 2004.11.19
申请人 SONY CHEM CORP 发明人 OGAWA YOSHIO;TAJIMA HIROSHI;NISHIMOTO MASAHIRO
分类号 H05K1/02 主分类号 H05K1/02
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