发明名称 SPUTTERING METHOD, SPUTTERING APPARATUS, PIEZOELECTRIC ELEMENT MANUFACTURING METHOD, AND LIQUID SPRAY HEAD
摘要 <P>PROBLEM TO BE SOLVED: To provide a sputtering method, a sputtering apparatus, a piezoelectric element manufacturing method, and a liquid spray head having a piezoelectric element capable of depositing an excellent thin film of the uniform film thickness on a substrate. <P>SOLUTION: When depositing a thin film by sputtering a target 402 on a surface of a substrate 110 arranged facing the target 402, the spacing (TS) between the surface of the target 402 and the surface of the substrate 110 is set to be &ge;100 mm. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006144090(A) 申请公布日期 2006.06.08
申请号 JP20040337870 申请日期 2004.11.22
申请人 SEIKO EPSON CORP 发明人 MURAI MASAMI;RI KINZAN
分类号 C23C14/34;B41J2/16;B81B3/00;H01L41/09;H01L41/187;H01L41/22;H01L41/29;H01L41/319;H01L41/39 主分类号 C23C14/34
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