发明名称 PHOTOPOLYMERIZABLE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photopolymerizable resin composition having high resolution, high adhesion, and resist stripping property as a resist material of an etching resist or a plating resist and excellent also in dispersion stability in a developer. <P>SOLUTION: The alkali-developable photopolymerizable resin composition contains (A) 30-80 mass% of a carboxyl group-containing binder, (B) 15-60 mass% of a photopolymerizable monomer and (C) 0.01-20 mass% of a photopolymerization initiator, wherein the carboxyl group-containing binder (A) contains a copolymer (a-1) having a weight average molecular weight of 5,000-500,000 obtained by copolymerizing at least 15-35 mass% of a monomer represented by formula (I), 10-80 mass% of a monomer represented by formula (II) and 1-50 mass% of a monomer represented by formula (III) in an amount of &ge;5 mass% based on 100 mass% of the component (A). <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006145844(A) 申请公布日期 2006.06.08
申请号 JP20040335849 申请日期 2004.11.19
申请人 ASAHI KASEI ELECTRONICS CO LTD 发明人 ARIHISA SHINJI;OKADA YUJI
分类号 G03F7/033;G03F7/004;G03F7/027;G03F7/028;H05K3/00 主分类号 G03F7/033
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