| 摘要 |
PROBLEM TO BE SOLVED: To obtain excellent heat dissipation effect even in a closed structure. SOLUTION: A circuit substrate 41 is stored lengthwise inside a closed metallic casing 50 consisting of a base 51 and a cover 65. An FET 45 which is a heat generating component disposed in the circuit substrate 41 is fixed in close contact with a heat exchanger plate 70 by a screw 71. The heat exchanger plate 70 is closely applied to a heat dissipation block 80 which is closely attached via an insulating sheet 76 to the bottom plate 53 of the base 51, and is fixed by screwing a screw 85 passing through an insulating sleeve 83 to a screw plate 87 applied to the surface of the heat exchanger plate 70. Heat dissipation fins 64, 64A are provided to project to the outer surface of the rear plate 52 of the base 51. Heat generated by the FET 45 is transmitted to the base 51 of the casing 50 from the heat exchanger plate 70 via the heat dissipation block 80, rises along the rear plate 52 provided with the heat dissipation fin 64, and is emitted into open air. COPYRIGHT: (C)2006,JPO&NCIPI |
