SHIELD CONFIGURATION FOR VACUUM CHAMBER

摘要

PROBLEM TO BE SOLVED: To eliminate unfavorable tensile stresses in a sputter deposited material to be deposited on a non-processed surface by heating so that the temperature of a shield reaches nearly the temperature of the sputter deposited material. SOLUTION: A shield 46 in a PVD (physical vapor deposition) vacuum processing chamber 30 is constituted so that generation of particles due to peeling off from the shield 46 and from arcing between a biased target and surrounding grounded pieces is reduced or prevented. The shield 46 has an "h" cross section with the lower arch of the "h" cross section facing a heater assembly which heats the shield 46 to a temperature approximately equivalent to the temperature of the sputter deposited material. The surface of the shield 46 is polished to promote the release of H2O molecules from its surface during the time when a vacuum is initially being pumped. The inside surface of the shield 46 (facing a heater assembly) is treated so as to have a higher coefficient of surface emissivity than the outer surface in order to enhance the efficiency of heating by retaining much more energy. COPYRIGHT: (C)2006,JPO&NCIPI