| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin board having hydrophilic or water-repellent film that can be formed with high hardness even on the surface of a resin having low heat resistance. SOLUTION: The hydrophilic film is formed on a resin and is formed of an inorganic oxide. The hydrophilic film has voids with a size in the range of 20-200 nm. The hydrophilic film with high hardness and increased abrasion resistance compared with hydrophilic films without voids can be obtained. Too large rate of voids must be avoided since it decreases the strength of the film. COPYRIGHT: (C)2006,JPO&NCIPI
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