Electronic part and manufacturing method thereof

摘要

An electronic component includes conductive pattern ( 2 ) on insulating substrate ( 1 ), a metal film formed by a plating method on a surface of conductive pattern ( 2 ), and metal oxide layer ( 3 ) formed by oxidizing the metal film on the surface of conductive pattern ( 2 ). This structure allows forming a thin and uniform insulating film on conductive pattern ( 2 ), so that the highly reliable electric component is obtainable although its conductive pattern ( 2 ) has a high aspect ratio.