Multi-level semiconductor module and method for fabricating the same

摘要

A multi-level semiconductor module according to the present invention is formed by alternately stacking resin boards and sheet members. Each of the resin boards is provided with a semiconductor device. The module includes: a rigid plate provided on one of the sheet members located at the top and having a heat dissipation efficiency higher than those of the resin boards and the sheet members; and a through buried conductor penetrating the resin boards and the sheet members and being in contact with the rigid plate.