发明名称 |
Method for joining semiconductor components with a flexible support band comprises moving an endless band parallel to the running direction of the support band between heating elements and the components |
摘要 |
<p>Method for joining semiconductor components (2) with a flexible support band (1) comprises moving an endless band parallel to the running direction (5) of the support band between first heating elements (7a-7c) and the semiconductor components and between a second heating element and the semiconductor components whilst the first heating elements exert a first pressure using a spring action. An independent claim is also included for a device for joining semiconductor components with a flexible support band.</p> |
申请公布号 |
DE102005006978(B3) |
申请公布日期 |
2006.06.08 |
申请号 |
DE20051006978 |
申请日期 |
2005.02.15 |
申请人 |
MUEHLBAUER AG |
发明人 |
BIERL, STEFAN;KUNZE, WOLFRAM;KLOOS, MATTHIAS;POENITZ, VOLKER;BERGMANN, DIETER |
分类号 |
H01L21/50;G06K19/077;H05K1/18 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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