BGA TO LGA INTERPOSER

摘要

The present invention provides an interposer that allows a BGA devise to interface with an LGA device. The interposer has an insulative substrate, at least one via provided through the substrate, the via having a first end and a second end for providing an electrical path through the substrate. A conductive pad is located on each end of the via. The conductive pads may be formed of different materials, such as solder material on one side of the interposer and gold on the other side of the interposer. The interposer may also include one or more standoffs on the side of the interposer having the conductive pads formed of a solder material.