发明名称 METHOD AND APPARATUS FOR PLACING CONDUCTIVE BALL
摘要 <P>PROBLEM TO BE SOLVED: To provide an improved method and apparatus for mounting conductive balls in a predetermined pattern on one surface of a base unit. <P>SOLUTION: The method of placing balls, having electrical conductivity in the predetermined pattern on one surface of the base unit, includes a first step in which one surface of an arrangement member is aligned to the one surface of the base unit, wherein the arranging member is provided to have the one surface, another surface opposite to the one surface, and positioning openings that correspond to the pattern so that the balls arranged can be inserted therein, and a second step of placing the balls onto the one surface of the base unit through the positioning openings by making a transfer device move horizontally with respect to the another surface of the arrangement member, wherein the transfer device is provided with two or more line members whose core axes are substantially aligned so that the line members are substantially in the horizontal position to be abuttable against with the balls supplied to the another surface of the arrangement member. A step, after the first step, of magnetically suctioning the arranging member toward the one surface side of the base unit, is also included. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006148146(A) 申请公布日期 2006.06.08
申请号 JP20050343594 申请日期 2005.11.29
申请人 HITACHI METALS LTD 发明人 ITO MOTOMICHI;OCHIAI MASANORI;WAI SHINICHI
分类号 H05K1/18;H01L21/60;H05K3/34 主分类号 H05K1/18
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