发明名称 PHOTORESIST COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide chemically amplified positive photoresist compositions containing a resin comprising acetal and alicyclic groups. <P>SOLUTION: The photoresist compositions comprise (i) one or more resins comprising one or more substituents comprising one or more photoacid-labile acetal groups and one or more alicyclic groups and (ii) one or more photoacid generator compounds. Photoresists of the invention can exhibit notably enhanced lithographic properties. Preferred photoresists of the invention comprise one or more photoacid generator compounds and one or more phenolic resins comprising one or more photoacid-labile acetal groups and one or more alicyclic groups (such as adamantyl). <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006146242(A) 申请公布日期 2006.06.08
申请号 JP20050338811 申请日期 2005.11.24
申请人 ROHM & HAAS ELECTRONIC MATERIALS LLC 发明人 JAMES F CAMERON;LEE DONG WOO;TREFONAS PETER III;SWANSON GARY J;SUNG JIN WUK
分类号 G03F7/039;H01L21/027 主分类号 G03F7/039
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