| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To efficiently cool a plurality of processor circuit boards. <P>SOLUTION: An electronic assembly comprises: a first PCB; and a module including a second PCB having (i) at least two processors, (ii) a thermal dissipation device disposed above the second PCB, dissipating heat away from the two processors and providing an airflow path, and (iii) a power system adjacent to the thermal dissipation device and in a pathway of the airflow path, wherein the module is removably coupled to and disposed above the first PCB. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
