| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for an area mounting type semiconductor sealing with both a high fluidity, a low warpage and resistance to soldering, and a semiconductor device using it. SOLUTION: The epoxy resin composition for the area mounting type semiconductor sealing is mainly composed of a crystalline epoxy resin (A), a phenol aralkyl resin having a biphenylene skeleton (B), a curing accelerator (C) and an inorganic filler (D) of 85 to 95 wt.% in the total epoxy resin composition, and having average particle sizes of 0.3-5μm and a low stress modifier (E) with maximum particle sizes of 10μm or less, and contains a compound (F) having 2 or more adjacent carbon atoms each bound with hydroxy group and constituting an aromatic ring at a particular ratio. The area mounting type semiconductor device is mounted with the semiconductor element on one side of the base plate and the semiconductor element is substantially sealed on only one side of the base plate surface mounted with the semiconductor element. COPYRIGHT: (C)2006,JPO&NCIPI |
