| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate which has conductivity equivalent to that of a thin metal film and is high in adhesion between the thin metal film and a substrate and a method for producing the laminate. SOLUTION: The laminate is composed of the insulating substrate having a thermoplastic polyimide resin layer as a surface layer and a thin metal film layer which is formed on the insulating substrate and in which fine metal particles 200 nm or below in particle size are fused together. The method for producing the laminate includes a process in which after a thermoplastic polyimide resin solution is applied on the insulating substrate, the solvent of the solution is removed to form the thermoplastic polyimide resin layer on the substrate and a process in which a dispersion containing fine thin metal film precursor particles 200 nm or below in primary particle size fused to each other by heating is applied on the thermoplastic polyimide resin layer, the coated layer is heated to make the thermoplastic polyimide resin plastic, and the thin metal film layer is formed on the thermoplastic polyimide resin layer. COPYRIGHT: (C)2006,JPO&NCIPI |
