METHOD OF MANUFACTURING THROUGH-HOLE SUBSTRATE FILLED WITH CONDUCTIVE MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a through-hole substrate filled with a conductive material, where a void does not exist in the conductive material with which the through-hole is filled. SOLUTION: A base conductive layer 15 is formed in one face of a core substrate 12 having the through-holes. The conductive material 16 is deposited and grown in the through-hole from one direction by electroplating with the base conductive layer as a feeding layer. The through-hole is filled with the conductive material without occurrence of the void and the through-hole substrate is manufactured as filled with the conductive material. COPYRIGHT: (C)2006,JPO&NCIPI