| 摘要 |
PROBLEM TO BE SOLVED: To make the inhibition of the peeling of the inside of a molding resin and the inhibition of the occurrence of a resin burr to the underside of an island and the external connecting surface of a lead terminal compatible in a QFN (a quad flat non-leaded package) type semiconductor device. SOLUTION: A semiconductor element 40 loaded on the island 11 through a die mounting material 30 and lead terminals 12 electrically connected to the semiconductor element 40 are sealed with the molding resin 60 so that the underside of the island 11 and the external connecting surfaces 12a of the lead terminals 12 are exposed. A heat sink 20 is interposed and set between the semiconductor element 40 and the top face of the island 11 in the molding resin 60, and the semiconductor element 40 is loaded on the top face of the heat sink 20 through the die mounting material 30. A roughening treatment for improving an adhesive property with the resin is carried out on the surface of the heat sink 20, and the surfaces of the island 11 and the lead terminals 12 are formed in smooth surfaces without the roughening treatment. COPYRIGHT: (C)2006,JPO&NCIPI
|
