| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor laser equipment for emitting a laser beam with high positional accuracy, by mounting a semiconductor laser element on a semiconductor substrate, with high accuracy and reliability. SOLUTION: A semiconductor laser element is placed over an SiN film formed on a p-type layer, with a heat sink layer and a solder layer (about 4μm of layer thickness), in addition to a Ti layer and an Au layer in between. The heat sink layer is inserted between the Au layer and the Ti layer and is approximately 20μm thick. The thickness of the heat sink layer is larger than that of the Au layer (0.4μm for the film thickness) for acquiring a mounting position for the semiconductor laser element in the thickness direction of the substrate. Further, a mirror part, acting as a reflecting part for a semiconductor laser beam, comprises an Al layer and a dielectric layer to form a reflecting film structure which exhibits high reflectance properties with respect to blue light. COPYRIGHT: (C)2006,JPO&NCIPI
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