| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic plating apparatus which can form a uniformly plated layer within the surface of a substrate to be treated, without wasting a semiconductor chip in the substrate to be treated, and to provide an electrolytic plating method therefor. SOLUTION: The electrolytic plating apparatus comprises: an accommodation tank 6 for accommodating a plating solution 5 in which the surface to be treated of the substrate 10 to be treated is immersed; a power-feeding means 4 which contacts with a scribe line for sectioning a plurality of unit elements included in the substrate 10, and is provided with a cathode 4a; and an anode 7 for applying voltage between it and the cathode 4a. COPYRIGHT: (C)2006,JPO&NCIPI
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