发明名称 METHOD FOR CUTTING GLASS SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To prevent the occurrence of cutting failures in a method for cutting a glass substrate for constituting a liquid crystal panel. SOLUTION: A seal layer 30 is formed on a first glass substrate 10 in such a manner that it includes a straight line part parallel to a line on which a scribe line SL is formed. Then, a dummy seal layer 30D is formed on the first glass substrate 10 in such a manner that it is in line symmetry with only the straight line part of the seal layer 30 with respect to the line on which the scribe line SL is formed. Further, a second glass substrate 20 is integrally stuck on the first glass substrate 10 through the seal layer 30 and the dummy seal layer 30D so as to form a laminated body 1. Thereafter, the laminated body 1 is cut and separated into each liquid crystal panel by subjecting each of the first and second substrates 10, 20 constituting the laminated body 1 to a scribing process and a breaking process. Lastly, liquid crystal is filled in the liquid crystal injection area 31 and sealed with a sealing material such as resin. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006143506(A) 申请公布日期 2006.06.08
申请号 JP20040333833 申请日期 2004.11.18
申请人 SANYO ELECTRIC CO LTD 发明人 TAGUCHI EIJI
分类号 C03B33/07;B28D5/00;C03B33/09;G02F1/13;G02F1/1333;G02F1/1339;G09F9/00;G09F9/35 主分类号 C03B33/07
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