| 摘要 |
A lead frame assembly includes at least two layers, each including an electrically conductive bus and a group of leads that extend substantially from a first edge of the assembly. The leads of each layer may include portions that extend in substantially the same direction. The electrically conductive buses are at least partially superimposed with respect to one another. Leads of one of the layers may be arranged in groups which flank the remainder of the lead of another layer. A dielectric element is disposed at least partially between the layers; for example, between at least portions of the superimposed regions of the buses. One of the buses may be connectable to a power supply source (V<SUB>cc</SUB>), while the other may be connectable to a power supply ground (V<SUB>ss</SUB>). In such an arrangement, the mutually superimposed regions of the buses may form a decoupling capacitor.
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