| 摘要 |
A method is provided for shaping tips of lithographically-produced probe elements configured for use in a probe card to establish electrical communication with a contact of a semiconductor device to be tested. The method includes (a) lithographically producing a plurality of probe elements and (b) using a subtractive process to remove material from each tip of the plurality of probe elements to form each tip into a shape well adapted to penetrate a contaminant oxide layer.
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