发明名称 Semiconductor device and manufacturing method thereof
摘要 A manufacturing method of a semiconductor device which can decrease the degradation of an element due to plasma in the LDD formation process is provided. The degradation of an element due to plasma is decreased by forming an element having an LDD structure according to a manufacturing method of a semiconductor device using a hard mask. Covering the substrate by an electrically conductive film allover, the density of electric charge accumulated in a gate electrode in the plasma process such as anisotropic etching can be reduced, and the degradation due, to plasma process can be reduced.
申请公布号 US2006118888(A1) 申请公布日期 2006.06.08
申请号 US20060328257 申请日期 2006.01.10
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 ISIKAWA AKIRA
分类号 H01L21/265;H01L29/76;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/78;H01L29/786 主分类号 H01L21/265
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