SEMICONDUCTOR COMPONENT COMPRISING A SEMICONDUCTOR CHIP PROVIDED WITH A PASSIVATION LAYER, AND METHOD FOR PRODUCING THE SAME

摘要

The invention relates to a semiconductor component (1) comprising a semiconductor chip (3) provided with a passivation layer (2), and to a method for the production thereof. According to said method, the passivation layer (2) covers the uppermost strip conductor structure (4) of the semiconductor chip (1), baring contact surfaces (5). Said passivation layer (2) is in direct adhesive contact with the plastic housing mass (6) of the semiconductor component (1) and comprises a polymer (7) with integrated mineral-ceramic nanoparticles (8).