SOLDER ALLOY

摘要

An alloy suitable for use in a wave solder process, reflow soldering process, hot air levelling process or a ball grid array, the alloy comprising from 0.08 - 3 wt.% bismuth, from 0.15 - 1.5 wt.% copper, from 0.1 - 1.5 wt.% silver, from 0 - 0.1 wt.% phosphorus, from 0 - 0.1 wt.% germanium, from 0 - 0.1 wt.% gallium, from 0 - 0.3 wt.% of one or more rare earth elements, from 0 - 0.3 wt.% indium, from 0 - 0.3 wt.% magnesium, from 0 - 0.3 wt.% calcium, from 0 - 0.3 wt.% silicon, from 0 - 0.3 wt.% aluminium, from 0 - 0.3 wt.% zinc, and at least one of the following elements from 0.02 - 0.3 wt% nickel, from 0.008 - 0.2 wt% manganese, from 0.01 - 0.3 wt% cobalt, from 0.01 - 0.3 wt% chromium, from 0.02 - 0.3 wt% iron, and from 0.008 - 0.1 wt% zirconium, and the balance tin, together with unavoidable impurities.