THIN SMALL OUTLINE PACKAGE IN WHICH MOSFET AND SCHOTTKY DIODE BEING CO-PACKAGED

摘要

The present invention provides a thin small outline package in which MOSFET and Schottky diode being co-packaged, which comprises a electrode S of MOSFET, a electrode G of MOSFET, a electrode D of MOSFET, electrode K and A of Schottky diode. The electrode D of MOSFET and electrode A of Schottky diode are located in the same side. It also comprises a lead frame. The lead frame comprises: the first lead is used as electrode K of Schottky diode and which is connected to the second carrier stage of Schottky diode; the fourth lead is used as electrode D of MOSFET and which is connected to the first carrier stage of MOSFET; the electrode D of MOSFET and the electrode K of Schottky diode are arranged in opposite side. This invention enables the electrode D of MOSFET and the electrode K of Schottky diode to arrange in the same side of packaging device. The structure of external output can be simplified, the current path can be shorten, the efficiency of power can be improved efficiently, the complicated level of design can be reduced, and the life-time of battery can be extended.