| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor package that can be easily deformed or processed depending on how optical devices and passive devices are mounted and has a circuit board structure that can be stably mounted on the mother board. <P>SOLUTION: In an optical semiconductor package 11 with a circuit board 12 and an optical device 13 and a passive device 14 which are both to be mounted on this circuit board 12, the circuit board 12 is a flexible board where an approximate L-shaped reinforced part 15 is formed at the edge, and an external connection terminal 16a for electricity of the optical device 13 and passive device 14 and an reinforced pattern 16b are established in the reinforced part 15. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
