| 摘要 |
PROBLEM TO BE SOLVED: To provide soldering equipment, capable of uniformly heating a printed circuit board and the mounted electronic components, and of soldering, without thermally damaging the electronic components in soldering equipment using lead-free solder. SOLUTION: The pressure of a fluid is allowed to be uniform and a porous body 130, having a plurality of pores, is disposed between a blower fan 122 and a heater 140. In addition, a radiation plate 150, that sprays the fluid heated by the heater 140 onto a heated object 10 as turbulent flow, is disposed between the heater 140 and the heated object 10, and the heated object is heated by spraying the heated fluid onto the heated object and melts the solder. COPYRIGHT: (C)2006,JPO&NCIPI |
