发明名称 INJECTION MOLD
摘要 PROBLEM TO BE SOLVED: To provide a technique which enhances the mold releasability of a molded product even if no mold release agent is used and can enhance the seizing resistance, abrasion resistance, heat resistance and corrosion resistance of a mold. SOLUTION: The injection mold 10 is composed of molds 10A and 10B for injection-molding a light guide member for guiding the light incident from a light source to cause surface emission and equipped with mold members 12A, 12B and 13 which demarcate the outer shape of the light guide member and can be moved between a mold clamping position and a mold opening position, the transfer members 11A and 11B provided to the mold members to transfer an optically functional surface to the light guide member and the mold release member 14 which is brought into slide contact with the mold members and the transfer members to release the molded product cured in the space surrounded by the mold members and the transfer members. A hard thin film layer with Vickers hardness of 500 Hv or above is formed to a region with which at least two members among the mold members, the transfer members and the mold release member come into slide contact. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006142510(A) 申请公布日期 2006.06.08
申请号 JP20040332034 申请日期 2004.11.16
申请人 NIDEC COPAL CORP 发明人 OTSU NOBUYUKI;TAKAHASHI YOSHIO
分类号 B29C45/37;B29C45/40;B29L11/00 主分类号 B29C45/37
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