发明名称 PLATE-LIKE THERMAL INSULATION MATERIAL CONNECTING BODY, THERMAL INSULATION CONSTRUCTION METHOD AND THERMAL INSULATION STRUCTURE USING THIS CONNECTING BODY
摘要 PROBLEM TO BE SOLVED: To provide a thermal insulation material and a thermal insulation structure for improving workability and thermal insulation confidentiality, in the thermal insulation structure for revealing high thermal insulation and high airtightness by using a plate-like thermal insulation material. SOLUTION: This plate-like thermal insulation material connecting body is formed by connecting two or more of plate-like thermal insulation materials 1a and 1b at a specific interval by a suspending material 2 in a position of substantially 1/2 of the thickness of the plate-like thermal insulation material. (1) The plate-like thermal insulation materials 1a and 1b are connected at a specific interval by sandwiching the suspending material 2 between layers when laminating a plurality of plate-like thermal insulation materials 1, or (2) the plate-like thermal insulation material is connected at a specific interval by fitting, inserting, sandwiching and fastening the suspending material by a fitting inserting locking recess-projection part of the plate-like thermal insulation material 1 turned into a thermal insulation structural material by being molded in a mold, or (3) the plate-like thermal insulation material 1 is integrally connected by connecting at a variable interval by sandwiching the suspending material 2 in a slidable state between the layers when laminating a plurality of plate-like thermal insulation materials 1a and 1b. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006144509(A) 申请公布日期 2006.06.08
申请号 JP20040339768 申请日期 2004.11.25
申请人 KAIKEN:KK 发明人 KAWAI TAMOTSU;OKUMURA NOBORU;OKUMURA SHINICHI;OSAWA YASUAKI;OKUMURA ZENICHI
分类号 E04B1/80;E04B1/76 主分类号 E04B1/80
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