发明名称 Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards
摘要 A method of embedding thick-film capacitors includes etching foil electrodes outside the boundary of the capacitor dielectric to prevent etching solutions from coming in contact with and damaging the capacitor dielectric layers.
申请公布号 US2006120015(A1) 申请公布日期 2006.06.08
申请号 US20040002748 申请日期 2004.12.02
申请人 BORLAND WILLIAM J 发明人 BORLAND WILLIAM J.
分类号 H01G4/228 主分类号 H01G4/228
代理机构 代理人
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