发明名称 Semiconductor device and method of manufacturing the same
摘要 A semiconductor device includes: a semiconductor layer portion provided on an insulating layer, the semiconductor layer portion becoming an element formation region; a gate insulating layer provided on the semiconductor layer portion; a gate electrode provided on the gate insulating layer; and an impurity region provided in the semiconductor layer portion, the impurity region becoming a source or drain region. The semiconductor layer portion is provided with a recess and an isolation insulating layer formed by filling the recess with an insulating material.
申请公布号 US2006118872(A1) 申请公布日期 2006.06.08
申请号 US20050298136 申请日期 2005.12.08
申请人 SEIKO EPSON CORPORATION 发明人 KATO TATSUSHI
分类号 H01L27/12 主分类号 H01L27/12
代理机构 代理人
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