| 摘要 |
<p>The invention discloses a printed board assembly, a PBA, (100, 300) comprising a first support layer (130, 350) with a first main surface (101) and a first layer (115, 319') of a conducting material. The PBA additionally comprises a first electronics component (110, 310) and a first cooling component (190, 390) for transporting heat from the first component to a cooling structure (395) external to the PBA. The first component (110, 310) is surface mounted on the PBA at least partially over the first cooling component (190, 390), and the first cooling component (190, 390) is arranged integrally in the PBA (100, 300), to conduct heat in a direction (D) which is essentially perpendicular to the first main surface (101) of the first support layer (130, 350). The first cooling component (190, 390) is arranged in the PBA (100, 300) by means of soldering.</p> |
