| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor apparatus highly reliable under temperature cycle environments. SOLUTION: The semiconductor apparatus includes a semiconductor chip 2 having a bump 4, a substrate 6 opposite to the semiconductor chip 2 having a wiring pattern electrically connected with the bump 4 formed, and a sealing resin 10 filled between the semiconductor chip 2 and the substrate 6 and formed to have a fillet 12 on a side face of the chip 2. An end of the fillet 12 is formed within 500μm in the parallel direction to the substrate 6 from the side face of the semiconductor chip 2. COPYRIGHT: (C)2006,JPO&NCIPI
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