发明名称 RESIN COMPOSITION AND CURED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a resin composition that has improved water absorption and improved dielectric constant in the novolak type cyanic ester resin composition that is suitably usable as a printed wiring board for forming electric circuits. SOLUTION: As a novolak type cyanic ester, is used a specific trifunctional cyanic ester. For example, a triphenylmethane type cyanic ester is used together and the water absorption is reduced in comparison with the conventional novolak type cyanic ester resin, thus produces a resin composition that is optimal for printed wiring boards having an extremely lowered dielectric constant. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006143874(A) 申请公布日期 2006.06.08
申请号 JP20040335586 申请日期 2004.11.19
申请人 MITSUBISHI GAS CHEM CO INC 发明人 UENO MASAYOSHI;NOZAKI MITSURU;SUGANO YUICHI;KATAGIRI MASAYUKI
分类号 C08G73/06 主分类号 C08G73/06
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