发明名称 |
MEMBRANE-LIMITED SELECTIVE ELECTROPLATING OF A CONDUCTIVE SURFACE |
摘要 |
This invention relates to processes and apparati for selectively electroplating a metal layer or layers into recessed topographic features on a conductive surface. The processes and apparati of the invention are useful for fabricating metal circuit patterns, for example for creating copper interconnects between integrated circuit elements embedded in a thin layer of dielectric material on the surface of a semiconductor wafer. |
申请公布号 |
WO2006060520(A2) |
申请公布日期 |
2006.06.08 |
申请号 |
WO2005US43387 |
申请日期 |
2005.11.11 |
申请人 |
E.I. DUPONT DE NEMOURS AND COMPANY;MAZUR, STEPHEN |
发明人 |
MAZUR, STEPHEN |
分类号 |
C25D7/12;H01L21/288;H01L21/768;H05K3/42 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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