Montagemethode für Halbleiterbauteile auf einer Leiterplatte

摘要

The present invention relates to a method for mounting a semiconductor element (103) to a circuit board (101) disposing an insulating adhesive (107) having a property of shrinking upon being set, at least at either of opposite faces (101a, 103b) confronted to each other of the circuit board (101) and the semiconductor element (103); registering the circuit board (101) and the semiconductor element (103) so that an electrode (102) on the circuit board corresponds to a projecting electrode (104) on the semiconductor element (103); coupling the opposite faces (101a, 103b) of the circuit board and the semiconductor element (103) by the insulating adhesive (107); setting the insulating adhesive (107) so that the electrode (102) on the circuit board (101) and the projecting electrode (104) on the semiconductor element (103) are electrically connected through the shrinkage of the insulating adhesive (107) so as to fix the semiconductor element (103) and the circuit board (101) in a coupled state; after fixing the circuit board (101) and the semiconductor element (103), bringing the circuit board (101) and the semiconductor element (103) under a pressure-reduced state lower than an atmospheric pressure; covering the semiconductor element (103) with a sealing resin agent (162) under the pressure-reduced state and returning the circuit board (101) and semiconductor element (103) to the atmospheric pressure so as to seal the semiconductor element (103) onto the circuit board (101) by the sealing resin agent (162). Moreover, the method comprises the further step of coating the sealing resin . agent (162) with a heat-radiating resin (163) after the semiconductor element (103) is sealed by the sealing resin agent (162).