| 摘要 |
<P>PROBLEM TO BE SOLVED: To make a protection cap for a sensor element unnecessary to be formed specially, to compactify a size, and to reduce a cost, in the structure for mounting a physical quantity sensor provided with the sensor element for detecting a physical quantity and a semiconductor device in a package. <P>SOLUTION: In the structure for mounting the physical quantity sensor provided with a sensor chip 3 for detecting the physical quantity, and the semiconductor device 6 connected electrically thereto, in the package 2, the sensor chip 3 is arranged in a recess 8 inside the package 2, the semiconductor device 6 is arranged in a support block 10 adjacent to the recess 8, the semiconductor device 6 is arranged with a free space 9 with respect to the sensor chip 3, in an upper side of the sensor chip 3, to restrain a movable member 41 of the sensor chip 3 from being excessively displaced by an excessive acceleration, and the size is reduced thereby. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
