发明名称 |
EINKAPSELUNGSMASSE MIT FLIESSMITTELEIGENSCHAFTEN UND VERWENDUNGSVERFAHREN |
摘要 |
<p>Encapsulated electrical component assemblies and methods of electrically connecting an electrical component having a plurality of component electrical terminations to a component carrying substrate having a plurality of substrate electrical terminations at surface mount reflow soldering conditions is described. The electrical and substrate components have an encapsulant-forming composition sandwiched therebetween and encasing said pluralities of component and substrate electrical connections. The described invention relates to using an encapsulant-forming composition comprising a thermosetting resin (preferably an epoxy resin) and a cross-linking agent (preferably an anhdride) for said resin that cross-links said resin and that also acts as a fluxing agent and optionally includes a catalyst for initiating cross-linking at required conditions. The gel point of the encapsulant-forming composition is reached after solder melt.</p> |
申请公布号 |
DE69634538(T8) |
申请公布日期 |
2006.06.08 |
申请号 |
DE1996634538T |
申请日期 |
1996.08.09 |
申请人 |
KAC HOLDINGS, INC. |
发明人 |
KIRSTEN, KENNETH J. |
分类号 |
H01L21/60;H01L23/488;B05D5/12;B23K35/02;B23K35/36;B32B15/08;B32B27/38;C08G59/18;C08G59/40;C08G59/42;C08G59/68;C08L63/00;H01B1/06;H01L21/56;H05K3/28;H05K3/32;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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