| 摘要 |
<P>PROBLEM TO BE SOLVED: To evaluate poor bonding in facedown mounting (surface mounting) semiconductor device, where the surface side of a semiconductor chip is connected with a mounting board. <P>SOLUTION: On the semiconductor chip 10 side, a test electrode 23 is formed by electrically separating the contact part of a bump electrode 21, at electrodes 15 and 16 in ohmic contact with semiconductor layers 12 and 13, at least partially from the periphery, a lead line is led out from the test electrode 23 and connected to a lead-out electrode. On the mounting board 20 side, a test pad is provided facing the lead-out electrode and a test bump electrode is formed on the test pad. Consequently, the junction of the electrodes 15, 16 and the electrode 21 can be electrically evaluated nondestructively, from the side of a circuit pattern formed on the mounting board 20 via the pad and the test pad on the mounting board 20 side. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
