| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conductive adhesive which has a long tack-free time and can improve workability for bonding semiconductor devices such as ICs and chip parts such as chip resistors and chip LEDs to lead frames, heat sinks and the like. <P>SOLUTION: The conductive adhesive comprises a silver powder (A), an epoxy resin (B) and a diluent (C). The diluent (C) is a liquid (poly)alkyleneglycol dialkyl ether having mol.wt. of at least 150 (for example, triethyleneglycol dimethyl ether or the like) and is contained in an amount of 1-20 wt% relative to the total amount. The silver powder (A) and the epoxy resin (B) are contained in an amount of 70-85 wt% and 4-36 wt%, relative to the total amount, respectively. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
